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1. 采用低損耗高密度金屬粉材料
2. 采用熱噴涂技術(shù),電感表面致密性好
3. 閉合磁路設(shè)計(jì),更好的抗電磁干擾
4. 高密度壓制成型，超高工作電流
5. T core 扁平線工藝，超低直流電阻

1. Utilization of low-loss high-density metal powder materials.

2. Utilization of thermal spraying technology, ensuring excellent surface compactness of the inductor.

3. Closed magnetic circuit design, providing enhanced electromagnetic interference resistance.

4. High-density compression molding, capable of handling extremely high operating currents.

5. T-core flat wire technique, achieving ultra-low direct current resistance.

平板電腦，顯示器，服務(wù)器，主板，大功率DC/DC模組

Applied in tablets, monitors, servers, motherboards,high-power DC/DC modules

Remark:

1. All test data is reference to 25℃ ambient.

2. Test Condition：1MHz，1Vrms

3. Isat: Max.Value, DC current at which the inductance drops less than 30% from its value without current; Typ. Value, DC current at which the inductance drops 30% from its value without current.

4. Irms: For Max. Value, ΔT＜40℃；for Typ. Value, ΔT is approximate 40℃.

5. Operat between temperature range -40℃ to +125℃(Including self - temperature rise)

6. Absolute maximum voltage: DC 60V

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